CCD is the core component of camera and directly influence camera`s quality, its development is the basis of camera`s upgrade.
There are two kinds of CCD Sensor, one is special CCD Sensor, such as CCD chip, backside illuminated and electron impact CCD or EBCCD, visible light CCD sensor, wide spectrum range(ultraviolet light→ visible light→ near infrared→ 3-5μm mid infrared→ 8-14μm far infrared) focal plane array and so on. Now there have many commercial products which are used in many different areas. The other one is universal type or consumption CCD Sensor.

1. The image surface size of CCD is developing towards integration and light.
Since the high cost of CCD silicon chip, the industry tries to make photoetching on one 6.5 inches silicon slice with more CCD Sensor chips. With the improvement of lithography machine, sizes of CCD develop to 1/2 inch, 1/3 inch, 1/4 inch and 1/5 inch. In 1993, 1/2 inch CCD Sensor is 5% of production, 1/4 inch CCD Sensor is 10% and 1/3 inch CCD Sensor is 85%. In 1997, the total output increased by 200% compared with 1993, but there is still a big development space for 1/2 inch CCD Sensor. The proportion of 1/4 inch CCD Sensor in total output is reducing compared with 1/3 inch CCD Sensor.

2. CCD Sensor is developing to high pixel and multi-system
The image surface size of CCD Sensor is decreasing but its pixels are on the rise, and pixel of 795(H) × 596(V) has taken the place of 512(H) × 596(V), even there is megapixel of CCD Sensor. For improving the resolution of horizontal and vertical direction, interlaced scanning is during the transition to progressive scanning.

3. Reducing the working voltage and power consumption
The early CCD cameras need to work under voltage of +24V, +22V, +17V and +5V, now the universal one is +12V, in order to match up with the use of network picture transmission and PC camera, voltage of +12V and +5V will be in the lead.

4. Advance the manufacturing efficiency of CCD camera
In order to reduce the cost of CCD camera and realize the high-speed automatic production, manufacturers are always seeking close structure and miniaturizing the CCD camera that is change from Dip Onboard (DOB) tin plate technology to the technology of connecting IC chips on Chip Onboard (COB). So far, the industry has achieved the technique of plates of multichip module (MCM).

5. Digital CCD camera
It has gradually realized the changes from old analog system to DSP digital processing when manufacturers are making CCD cameras. Computers and professional software system can make quantitative adjustment of CCD camera especially the color CCD camera`s parameters and ensure the optimization consistency of CCD camera`s performance index, also do quantitative modify to parameters in particular service conditions.